QUOTE(ClayPerrine @ Mar 30 2022, 04:31 PM)
@Superhawk996 did you ever stop to think that crimping a joint is cheaper and faster to make than a soldered joint? Maybe that is the reason the big car manufacturers do it?
Indeed I have. It is not just automotive that prefers crimped connectors.
I think we are splitting hairs to a degree. As previously noted by others, a soldered splice in a section of harness that isn't being exposed to bending stress and has no cyclic fatigue is a low probability of failure. I think we can all agree on that. The bigger issue is improper use of acid core flux which will corrode copper wiring. Most folks grab what is at hand and will use it without knowing to avoid acid core for electronics.
I have seen the NASA standard you reference and agree that there are acceptable uses for soldered splices, but as you note, most people don't do them well.
With respect to terminations, the data is very clear that for terminations (i.e. at terminals, ring connectors, pins, etc.) that a crimped connection is superior. This has been proven out in laboratory testing with cyclic fatigue on shaker tables. In the same manner here is NASA's own word on the robustness of crimped terminations.
Click to view attachmenthttps://workmanship.nasa.gov/lib/insp/2%20b...quirements.htmlI do admit that I'm a bit black and white on this and prefer crimped connectors all around. This is based on years of experience seeing where and how often soldered connections (especially at terminations) failed in the field.
Excerpt from the standard Clay referenced:
13.3 Assembly of Solder-Type Connectors
13.3.1 Wire shall be bent only in flexible, unwicked parts of the conductor to maintain stress
relief for solder dipped conductors. In all instances, stranded conductors will experience solder-
wicking during attachment. The conductor will be rigid up to the point where the wicking stops
and flexible beyond it. Wire movement concentrates stress at the point where wicking stops and
normal harness handling can produce conductor fatigue and failure.
13.3.2 Solid conductors shall be assembled in contacts by soldering, and cleaned and inspected
in accordance with the latest revision of IPC J-STD-001FS.
13.3.3 Contact mating surfaces and solder joints shall be cleaned to remove flux residue
following the soldering operation.
Note: CAUTION: WHERE SOLDER CONTACTS HAVE FLOAT, FLUX MAY RUN
DOWN ONTO THE MATING SURFACE OF THE CONTACT DURING SOLDERING
AND CAUSE INTERMITTENT AND OPEN CIRCUITS.
By no means do I want this to be perceived as a personal attack on Clay.